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Material
Ceramic Resin

Ceramic Resin

Engineering Plastics
FunctionalStrongHeat resistantHigh detail

Ceramic resin is a specialized photopolymer formulated with glass- or ceramic-filled particles, designed to deliver exceptional rigidity, thermal stability, and precision when printed with LCD/MSLA systems. The material cures into a dense, stiff, low-shrink polymer matrix, providing mechanical behavior closer to technical ceramics or fiber-reinforced composites than standard resins. Thanks to its high stiffness, low thermal expansion, and resistance to deformation under heat, ceramic resin is well suited for heat-resistant fixtures, molds, tooling, jigs, precision housings, and dimensional test components. Its content enhances both surface hardness and compressive strength, making it ideal for structural applications that require stability and rigidity. Although the material is more brittle than engineering resins, it offers superior accuracy and detail, especially for finely featured or load-bearing shapes. Ceramic resin parts may be further post-baked or kiln-fired (depending on the manufacturer) to increase density and ceramic-like performance, though many users rely solely on standard UV post-curing. Overall, ceramic resin combines engineering-grade stiffness, high detail resolution, and heat performance, making it a strong choice for industrial and precision applications requiring ceramic-like behavior from an LCD-printed part.

Print with Ceramic Resin
Mechanical Properties
Tensile strength40–65 MPa
Tensile modulus4500–10000 MPa
Elongation1–2 %
Flexural strength9–400 MPa
Flexural modulus995–5400 MPa
Density1.55 g/cm³
Print Constraints

Maximum build volume

285 × 155 × 270 mm

Default layer height0.05 mm
Default infill100%
Min embossing0.04 mm
Min engraving0.04 mm
Accuracy± 0.1 mm
Warping riskLow
Interlocking partsNot supported

Available finishes

Each finish can be combined with the available colors at checkout.

Standard

Standard

1 color

Standard Ceramic Resin parts feature a smooth matte surface. The material provides high stiffness, excellent detail resolution, and low thermal expansion, ideal for rigid functional components and heat-resistant applications.

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